ElectroHolography Laboratory

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====E19====

==Past:==

X-cut. Resistor Bridge with 50nm of Nickel.

===Current:===
The Device looks like the following:\\
^  Before Bake  ^  After Bake @ 375°C for 30 min  ^
|  {{:samples:e:e19_t1.jpg?400|E19_T1}}  |  {{:samples:e:e19_t1_ab.jpg?400|E19_T1_Ab}}  |
|  {{:samples:e:e19_t2.jpg?400|E19_T2}}  |  {{:samples:e:e19_t2_ab.jpg?400|E19_T2_AB}}  |
|  {{:samples:e:e19_t3.jpg?400|E19_T3}}  |  {{:samples:e:e19_t3_ab.jpg?400|E19_T3_AB}}  |

==Layout==
^  Before Bake  ^  After Bake @ 375°C for 30 min  ^
|  %%1■____■7%%\\ 2■¯¯¯¯■8\\ %%3■____■9%%\\ 4■¯¯¯¯■10\\ %%5■____■11%%\\ 6■¯¯¯¯■12  |  %%6■____■7%%\\ 5■¯¯¯¯■8\\ %%4■____■9%%\\ 3■¯¯¯¯■10\\ %%2■____■11%%\\ 1■¯¯¯¯■12  |


==Resistance==

^  Before Bake  ^  After Bake @ 375°C for 30 min  ^
| 5-6: 170kΩ  |  1-2: 41kΩ  |
|    |  3-4: 19kΩ  |
|    |  5-6:   |
|    |  7-8:   |
|  9-10: 278Ω  |  9-10:   |
|    |  11-12:   |

==Connectivity test==
5 and 6 are the two pads. 10-12 were rebonded from top to bottom across the aluminum fingers to test connectivity. The wire bounding looks as follows:

{{:samples:e:e19_t1_ct.jpg?500|}}

5-6: 23.7Ω

5-10: 536Ω\\
5-11: 544Ω\\
5-12: 838Ω\\

6-10: 529Ω\\
6-11: 538Ω\\
6-12: 845Ω\\

10-11: 320Ω\\
10-12: 1.36kΩ\\
11-12: 1.38kΩ\\

This suggests connectivity between the pads, the resistive strip, and the fingers.

==Future:==

ElectroHolography Laboratory

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