====D1====
sign
{{:samples:d:d1d.jpg?direct&100|}}
low f
{{:samples:d:d1b.jpg?direct&100|}}
medium f
{{:samples:d:d1c.jpg?direct&100|}}
high f
{{:samples:d:d1e.jpg?direct&100|}}


==Past:==

D1 is X-cut and has not been proton exchanged or annealed. 

It was prepped with PMMA and Aquasave for ESEM patterning of long transducers and then developed. 

Evaporated 10nm Nickel as an adhesive layer and then 200nm Aluminum, went through liftoff. 

Liftoff not successful. 

Wire-Bonded.

Smith Charts and SWR for each port **Before Impedance Matching** (As counted from the top):

^            T1               ^            T2              ^            T3              ^
|  {{:samples:d:d1t1smith.jpg?200|}}   |  {{:samples:d:d1t2smith.jpg?200|}}  |  {{:samples:d:d1t3smith.jpg?200|}}  |
|  {{:samples:d:d1t1swr.jpg?200|}}   |  {{:samples:d:d1t2swr.jpg?200|}}  |  {{:samples:d:d1t3swr.jpg?200|}}  |
|            T4               |            T5              |            T6              |
|  {{:samples:d:d1t4smith.jpg?200|}}   |  {{:samples:d:d1t5smith.jpg?200|}}  |  {{:samples:d:d1t6smith.jpg?200|}}  |
|  {{:samples:d:d1t4swr.jpg?200|}}   |  {{:samples:d:d1t5swr.jpg?200|}}  |  {{:samples:d:d1t6swr.jpg?200|}}  |


Smith Charts and SWR for each port **After Impedance Matching** (As counted from the top):

^            T1               ^            T2              ^            T3              ^
|  {{:samples:d:d1t1smithafter.jpg?200|}}   |  {{:samples:d:d1t2smith.jpg?200|}}  |  {{:samples:d:d1t3smith.jpg?200|}}  |
|  {{:samples:d:d1t1swrafter.jpg?200|}}   |  {{:samples:d:d1t2swr.jpg?200|}}  |  {{:samples:d:d1t3swr.jpg?200|}}  |
|            T4               |            T5              |            T6              |
|  {{:samples:d:d1t4smithafter.jpg?200|}}   |  {{:samples:d:d1t5smithafter.jpg?200|}}  |  {{:samples:d:d1t6smith.jpg?200|}}  |
|  {{:samples:d:d1t4swrafter.jpg?200|}}   |  {{:samples:d:d1t5swrafter.jpg?200|}}  |  {{:samples:d:d1t6swr.jpg?200|}}  |


==Current:==

Ready for wire-bonding tests. 

==Future:==

Cleaned in Al etch and nanostrip, prepped again for ESEM. 

------



Sample fabricated by Jacob Kimball\\
Wire Bonding done by Taylor DeGraw
page updated 14 May 2015