E19

Past:

X-cut. Resistor Bridge with 50nm of Nickel.

Current:

The Device looks like the following:

Before Bake After Bake @ 375°C for 30 min
E19_T1 E19_T1_Ab
E19_T2 E19_T2_AB
E19_T3 E19_T3_AB
Layout
Before Bake After Bake @ 375°C for 30 min
1■____■7
2■¯¯¯¯■8
3■____■9
4■¯¯¯¯■10
5■____■11
6■¯¯¯¯■12 		6■____■7
5■¯¯¯¯■8
4■____■9
3■¯¯¯¯■10
2■____■11
1■¯¯¯¯■12
Resistance
Before Bake After Bake @ 375°C for 30 min
5-6: 170kΩ 1-2: 41kΩ
3-4: 19kΩ
5-6:
7-8:
9-10: 278Ω 9-10:
11-12:
Connectivity test

5 and 6 are the two pads. 10-12 were rebonded from top to bottom across the aluminum fingers to test connectivity. The wire bounding looks as follows:

5-6: 23.7Ω

5-10: 536Ω
5-11: 544Ω
5-12: 838Ω

6-10: 529Ω
6-11: 538Ω
6-12: 845Ω

10-11: 320Ω
10-12: 1.36kΩ
11-12: 1.38kΩ

This suggests connectivity between the pads, the resistive strip, and the fingers.

Future: