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samples:d3

D3

sign

low f med f high f

Past:

D3 is X-cut and has not been proton exchanged or annealed.

It was prepped with PMMA and Aquasave for ESEM patterning of long transducers and then developed.

Evaporated 10nm Titanium as an adhesive layer and then 200nm Aluminum, went through liftoff.

Liftoff not successful.

Wire bonded.

Smith Charts and SWR for each port Before Impedance Matching (As counted from the top):

T1 T2 T3
T4 T5 T6
Current:

Ready for wire-bonding tests.

Future:

Cleaned in Al etch and nanostrip, prepped again for ESEM.


Sample fabricated by Jacob Kimball
page updated 6 May 2015

samples/d3.txt · Last modified: 2015/07/21 13:15 by sgneitin