ElectroHolography Laboratory

This page is read only. You can view the source, but not change it. Ask your administrator if you think this is wrong.

**Wire Bonder Documentation**
{{::7476e_manual.pdf|Wire Bonder Documentation}}

===Wire Bonding===

Note: it is very difficult for wire bonding to be successful on metal layers less than 200nm thick. 

1.Create sample mount (either glass or 3D printed)
  -Take two glass slides and break one into thirds (parallel to the short edge)
  -Using the grinder, round off the two side pieces until they are quarter circles (the boring end of the banana in     shape)
  -Place the three pieces in order across the second glass slide
  -Super glue the two side pieces with half their height above the lip of the bottom slide
  -Super glue the center piece 1mm below the top edge of the bottom slide
  -Wrap the two horns with double sided tape, then put foam tape across the tops of them
  -Attach a set of breakout board wings on the foam tape,  about 1 mm above the edge of the bottom slide
  -Place a third glass slide in line with the bottom slide, below the wings (for stability)
2.Place LN sample below transducer breakout board
  -Tape sample down, with the transducer end hanging over the center third of the top slide about 1 mm
        -Make sure that there is space for the wire bonder to reach the sample (be wing board isn’t in the way)
3.Place the sample and holder on the wire bonder’s circular stand
4.Adjust the height of the stand if necessary to reach the sample and the wing board

ElectroHolography Laboratory

User Tools

Site Tools

Page Tools