Dylan Barton, Daniel Pettingill, Dan Kurtz Spring/Summer 2018

Test 3 We used a new translated chip, to more successful results then in test 1 (7/9/18). A continued note on the instability of the SMA connection method. Holding down the connections resulted in additional dB on the signal, even more then the base signal. Indication that even with the base signal there may be some sort of problem with the connectors.

Test 2 Dan K. made new chips using the mirroring transducer set up that Dan P. found from his research and literature search. This one appears much more successful.

A note about the connections - to summarize, they are quite finicky. Dylan is going to work on (as time permits) a way to secure the connections, allowing for detaching/re-attaching with more ease.

Also this is the download for the “.stl” file for a 3D printed holder for both attachment plates, and the chip. Download it and change the file type to “.stl”, then it can be used with the 3D printer in the lab. If you are on Chrome, to download the PDF instead of just fail to open it in the browser, search the settings for “pdf” and find the option to download instead of open pdfs.

“Test 1” Dan created a set of chips, 18 to one plate, cut them out and put together a test chip with connections to the transducers. The transducer was translated.

We seem to be getting a loss of about 10 dB when we pass it through the chip. Need to discuss possible problems